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HPE Intel Xeon E3110 processor 3 GHz 6 MB L2
SKU
463509-001
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Intel Xeon Processor E3110 (6M Cache, 3.00 GHz, 1333 MHz FSB)
| Processor socket | LGA 775 (Socket T) |
|---|---|
| Processor cores | 2 |
| Processor family | Intel Xeon 3000 |
| Processor lithography | 45 nm |
| SKU | 463509-001 |
| EAN | 5711045290695 |
| Manufacturer | HPE |
| Availability | Out of Stock |
The Dual-Core Intel® Xeon® Processor 3100 Series, like the previous Dual-Core Intel® Xeon® Processor 3000 Series, are based on the Intel® Core™ microarchitecture. The Intel Core microarchitecture combines the performance of previous generation products with the power efficiencies of a low-power microarchitecture to enable smaller, quieter systems. The Dual-Core Intel® Xeon® Processor 3100 Series is a 64-bit processor that maintains compatibility with IA-32 software.
The processor is a dual-core processor, based on 45-nm process technology. The processor features the Intel® Advanced Smart Cache, a shared multi-core optimized cache that significantly reduces latency to frequently used data. The processor features a 1333 MHz front side bus (FSB) and 6 MB of L2 cache. The processor supports all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3), Supplemental Streaming SIMD Extension 3 (SSSE3), and the Streaming SIMD Extensions 4.1 (SSE4.1). The processor supports several Advanced Technologies: Execute Disable Bit, Intel® 64 architecture, Enhanced Intel SpeedStep® Technology, Intel® Virtualization Technology (Intel® VT), and Intel® Trusted Execution Technology (Intel® TXT).
The processor's front side bus (FSB) utilizes a split-transaction, deferred reply protocol. The FSB uses Source-Synchronous Transfer of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a "double-clocked" or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 10.7 GB/s.
The processor is a dual-core processor, based on 45-nm process technology. The processor features the Intel® Advanced Smart Cache, a shared multi-core optimized cache that significantly reduces latency to frequently used data. The processor features a 1333 MHz front side bus (FSB) and 6 MB of L2 cache. The processor supports all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3), Supplemental Streaming SIMD Extension 3 (SSSE3), and the Streaming SIMD Extensions 4.1 (SSE4.1). The processor supports several Advanced Technologies: Execute Disable Bit, Intel® 64 architecture, Enhanced Intel SpeedStep® Technology, Intel® Virtualization Technology (Intel® VT), and Intel® Trusted Execution Technology (Intel® TXT).
The processor's front side bus (FSB) utilizes a split-transaction, deferred reply protocol. The FSB uses Source-Synchronous Transfer of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a "double-clocked" or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 10.7 GB/s.
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Thermal Design Power (TDP) | 65 W |
| Processor cache | 6 MB |
| Processor model | E3110 |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.85 - 1.3625 V |
| FSB Parity | No |
| Component for | Server/workstation |
| Processor lithography | 45 nm |
| Processor family | Intel® Xeon® 3000 Sequence |
| Processor front side bus | 1333 MHz |
| Processor cores | 2 |
| Processor socket | LGA 775 (Socket T) |
| Processor cache type | L2 |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 65 W |
| VID Voltage Range | 0.85 - 1.3625 V |
| Technical details | |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Number of Processing Die Transistors | 410 M |
| Processing Die size | 107 mm² |
| Intel Demand Based Switching | No |
| Embedded options available | No |
| Thermal Design Power (TDP) | 65 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L2 |
| Features | |
|---|---|
| Thermal Design Power (TDP) | 65 W |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 410 M |
| Processing Die size | 107 mm² |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Intel Demand Based Switching | No |
| Intel Virtualization Technology (VT-x) | Yes |
| Operational conditions | |
| Tcase | 72.4 °C |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-x |