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HPE Intel Pentium D 830 processor 3 GHz 2 MB L2 Tray
SKU
398445-001
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Out Of Stock - Contact for availability
Intel® Pentium® D Processor 830 (2M Cache, 3.00 GHz, 800 MHz FSB)
| Processor socket | LGA 775 (Socket T) |
|---|---|
| Box | No |
| Processor cores | 2 |
| Processor family | Intel Pentium D |
| SKU | 398445-001 |
| EAN | 5704327162339 |
| Manufacturer | HPE |
| Availability | Out of Stock |
Enjoy brilliant PC performance that lets you communicate with friends and family, enjoy entertainment, and get your work done. With the benefits of an impressive laptop and the convenience of a tablet, a 2 in 1 with an improved Intel® Pentium® processor covers your computing needs beautifully. Get the Intel-level performance you've come to expect and quality you can count on with an Intel Pentium processor.
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 2 MB |
| Processor model | 830 |
| Processor operating modes | 64-bit |
| FSB Parity | No |
| Processor lithography | 90 nm |
| Processor family | Intel® Pentium® D |
| Processor front side bus | 800 MHz |
| Processor cores | 2 |
| Processor socket | LGA 775 (Socket T) |
| Processor cache type | L2 |
| Package type | Tray |
| Memory | |
| ECC | No |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| Technical details | |
| Thermal Monitoring Technologies | No |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | No |
| Number of Processing Die Transistors | 230 M |
| Processing Die size | 206 mm² |
| Intel Demand Based Switching | No |
| Embedded options available | No |
| Thermal Design Power (TDP) | 130 W |
| Processor cache type | L2 |
| Features | |
|---|---|
| Thermal Design Power (TDP) | 130 W |
| Thermal Monitoring Technologies | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 230 M |
| Processing Die size | 206 mm² |
| Embedded options available | No |
| Processor special features | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | No |
| Intel Demand Based Switching | No |
| Operational conditions | |
| Tcase | 69.8 °C |
| Packaging data | |
| Package type | Tray |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | No |