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HP Intel Xeon X5570 processor 2.93 GHz 8 MB L3
SKU
536899-001
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Out Of Stock - Contact for availability
Intel Xeon X5570, 8M Cache, 2.93 GHz, 6.40 GT/s Intel QPI
| Processor socket | Socket B (LGA 1366) |
|---|---|
| Processor cores | 4 |
| Processor family | Intel Xeon 5000 |
| Processor lithography | 45 nm |
| SKU | 536899-001 |
| EAN | 5711045202711 |
| Manufacturer | HP |
| Availability | Out of Stock |
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| Processor | |
|---|---|
| Processor base frequency | 2.93 GHz |
| Memory bandwidth supported by processor (max) | 32 GB/s |
| Thermal Design Power (TDP) | 95 W |
| Processor cache | 8 MB |
| Processor model | X5570 |
| Processor threads | 8 |
| System bus rate | 6.4 GT/s |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.750 - 1.350 V |
| Processor boost frequency | 3.333 GHz |
| Number of QPI links | 2 |
| Bus type | QPI |
| Component for | Server/workstation |
| Processor lithography | 45 nm |
| Processor family | Intel® Xeon® 5000 Sequence |
| Processor cores | 4 |
| Processor socket | Socket B (LGA 1366) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 144 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 800,1066,1333 MHz |
| Memory bandwidth supported by processor (max) | 32 GB/s |
| Memory channels | Triple-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 95 W |
| VID Voltage Range | 0.750 - 1.350 V |
| Technical details | |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Number of Processing Die Transistors | 731 M |
| Processing Die size | 263 mm² |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Embedded options available | No |
| CPU configuration (max) | 2 |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 95 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
|---|---|
| Thermal Design Power (TDP) | 95 W |
| Processor package size | 42.5 mm |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 731 M |
| Processing Die size | 263 mm² |
| Embedded options available | No |
| CPU configuration (max) | 2 |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Operational conditions | |
| Tcase | 75 °C |
| Weight & dimensions | |
| Processor package size | 42.5 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| CPU configuration (max) | 2 |