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HP Intel Core 2 Duo E8300 processor 2.83 GHz 6 MB L2 Tray
SKU
466168-001
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Out Of Stock - Contact for availability
Intel Core 2 Duo Processor E8300 (6M Cache, 2.83 GHz, 1333 MHz FSB)
| Processor socket | LGA 775 (Socket T) |
|---|---|
| Box | No |
| Processor cores | 2 |
| Processor family | Intel Core 2 Duo |
| SKU | 466168-001 |
| EAN | 5704327603573 |
| Manufacturer | HP |
| Availability | Out of Stock |
Desktop PCs with the Intel® Core™2 processor family deliver faster performance, greater energy efficiency, and more responsive multitasking, so your company can be more productive.
Combining mainstream processing speeds with power-saving features, desktop PCs with the Intel Core 2 processor family let you get more done in less time, reducing energy costs by an average of 50 percent.¹
With an Intel® Core™2 Duo processor you will get performance-rich technologies, including up to 6MB of shared L2 cache, up to 1333 MHz Front Side Bus, plus these additional Intel® technologies built in:
Intel® multi-core processing
provides greater multitasking performance by combining two independent processor cores in one physical package¹
Intel® Wide Dynamic Execution
improves execution time and energy efficiency with more instructions per clock cycle
Intel® Intelligent Power Capability
enables smarter, more energy-efficient performance
Intel® Smart Memory Access
improves system performance by optimizing the use of the available data bandwidth
Intel® Advanced Smart Cache
enables higher performance and more efficient cache subsystem by optimizing for multi-core processors
Intel® Advanced Digital Media Boost
accelerates a broad range of applications including video, speech and image, photo processing, encryption, financial, engineering, and scientific applications
Combining mainstream processing speeds with power-saving features, desktop PCs with the Intel Core 2 processor family let you get more done in less time, reducing energy costs by an average of 50 percent.¹
With an Intel® Core™2 Duo processor you will get performance-rich technologies, including up to 6MB of shared L2 cache, up to 1333 MHz Front Side Bus, plus these additional Intel® technologies built in:
Intel® multi-core processing
provides greater multitasking performance by combining two independent processor cores in one physical package¹
Intel® Wide Dynamic Execution
improves execution time and energy efficiency with more instructions per clock cycle
Intel® Intelligent Power Capability
enables smarter, more energy-efficient performance
Intel® Smart Memory Access
improves system performance by optimizing the use of the available data bandwidth
Intel® Advanced Smart Cache
enables higher performance and more efficient cache subsystem by optimizing for multi-core processors
Intel® Advanced Digital Media Boost
accelerates a broad range of applications including video, speech and image, photo processing, encryption, financial, engineering, and scientific applications
| Processor | |
|---|---|
| Processor base frequency | 2.83 GHz |
| Thermal Design Power (TDP) | 65 W |
| Processor cache | 6 MB |
| Processor model | E8300 |
| Processor operating modes | 64-bit |
| Stepping | C0 |
| FSB Parity | No |
| Processor lithography | 45 nm |
| Processor family | Intel® Core™2 Duo |
| Processor front side bus | 1333 MHz |
| Processor cores | 2 |
| Processor socket | LGA 775 (Socket T) |
| Processor cache type | L2 |
| Package type | Tray |
| Power | |
| Thermal Design Power (TDP) | 65 W |
| Technical details | |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Number of Processing Die Transistors | 410 M |
| Processing Die size | 107 mm² |
| Intel Demand Based Switching | No |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 65 W |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L2 |
| Features | |
| Thermal Design Power (TDP) | 65 W |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 410 M |
| Processing Die size | 107 mm² |
| Embedded options available | No |
| Processor special features | |
|---|---|
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel Demand Based Switching | No |
| Intel Virtualization Technology (VT-x) | Yes |
| Operational conditions | |
| Tcase | 72.4 °C |
| Packaging data | |
| Package type | Tray |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |